Xiaomi has set a precedent for promoting innovation in the smartphone industry. From the Mi MIX wireless radios to the 10GB RAM package in the first Mi MIX 3, Xiaomi has demonstrated its capabilities in the mobile space. But innovations do not stop there. The next flagship of the line, Mi 9, is ready to bring some invisible and irritating features.
New information about the Xiaomi Mi 9 appeared on the internet, suggesting that the upcoming smartphone will be the first in the Qualcomm Snapdragon 8150 sports chipset (formerly Snapdragon 855). Based on this information, GizChina claims Mi 9 will arrive at some point in the first half of 2019, which is in line with Xiaomi's annual upgrading plans.
Qualcomm's Snapdragon 8150 unlocks a new potential on a smartphone. It is based on the TSMC Finfet 7nm processing technology with two large cores, two medium and four small cores. The three-core kernel design of the chipset is similar to what we saw in Kirin 980 of Huawei.
In addition to the equipment of the best chipset at home, the Xiaomi Mi 9 will also be the company's first smartphone with three-sided curves. According to iGeekPhone, the Mi 9 camera installation will include a 48MP Sony IMX586 sensor, which features a CMOS and Quad Bayer 4-pixel 1 / 2.0-inch Quad Bayer filter for some amazing low-light shooting.
Finally, the last piece of information leaked for Mi 9 is the RAM configuration. As expected, there will be many variations with different storage and RAM configurations, and the report indicates that the Mi 9 will have RAM options of 6GB, 8GB and 10GB.
Other features included in the Mi 9 are a fingerprint reader, 512 GB RAM, wireless charging support and some kind of IP certification for dust and water resistance. We just have to wait and watch.